The launching of the mini-STX form-factor graded a compact form-factor for programs with processors having a TDP as much as 65W. Nonetheless, the mini-STX form-factor including connected cooling system remains to be too cumbersome for specific usage. Most systems developed in that form-factor have appreciable z-height to hold a standard heat-sink and a single fan. The working system volume is between 1.54L and 1.92L, depending on the chassis.
Shuttle’s XPC slim series aims to serve the market section needing standard desktop processors in a compact form factor. These computer systems are a match for quite a lot of enterprises and industrial purpose.
Shuttle’s XPC slim series contains two different form-factors – the XH version uses a 17cm x 17cm motherboard in a 3.5L chassis, whereas the DH version uses a bit smaller board in a 1.35L frames. The product is offered ‘barebones’ much like the mini-STX products available in the market (and in contrast to the NUCs). The board is spacious, and the top user can decide to put in any Coffee Lake-S CPU (as much as 65W TDP) in the system. The user should add the RAM (DDR4 SO-DIMMs) and storage drive(s) (M.2 NVMe and 2.5″ SATA drive). Shuttle provides a twin fan cooling solution together with the system. The selection of CPU makes it just like a DIY construct in many aspects.
The barebones model of the DH370 is supported by a rich set of elective accessories to higher match particular use. These embody the ability to interchange one of many two COM ports with a VGA display output port (utilizing the PVG-01). Including Wi-Fi abilities (utilizing the WLN-M WLAN card and antennae), capacity to set off power switching when the unit is set in a tough-to-reach location (using the 2m long CXP01 cable for an exterior power change). Rackmount equipment permitting for the set of two XPC slim models in a 2U slot (PRM01), and stands (PS02) for vertical dimensions of the system.